10 Layer ENIG FR4 Via In Pad PCB
Via In Pad PCB
Ma ka hoʻolālā PCB, ʻo ka puka puka he spacer me kahi puka liʻiliʻi i uhi ʻia i ka papa kaapuni i paʻi ʻia e hoʻohui i nā ala keleawe ma kēlā me kēia papa o ka papa.Aia kekahi ʻano puka puka i kapa ʻia ʻo microhole, nona ka puka makapō i ʻike ʻia ma ka ʻili hoʻokahi.kiʻekiʻe-density multilayer PCBa i ʻole he lua i kanu ʻole ʻia ma kēlā me kēia ʻili.ʻO ka hoʻolauna ʻana a me ka hoʻohana ākea o nā ʻāpana pin kiʻekiʻe, a me ka pono o ka PCBS liʻiliʻi, ua lawe mai i nā pilikia hou.No laila, ʻoi aku ka maikaʻi o ka hoʻohana ʻana i ka ʻenehana hana PCB hou loa i kapa ʻia ʻo "Via in Pad".
I nā hoʻolālā PCB o kēia manawa, koi ʻia ka hoʻohana wikiwiki ʻana o ka via i ka pad ma muli o ka emi ʻana o ka spacing o nā wāwae wāwae a me ka miniaturization o nā coefficients shape PCB.ʻO ka mea nui loa, hiki iā ia ke hoʻokuʻu i ka hōʻailona ma nā wahi liʻiliʻi o ka hoʻolālā PCB e like me ka hiki a, i ka hapa nui o nā hihia, ʻaʻole i ka pale ʻana i ka perimeter i noho ʻia e ka hāmeʻa.
He mea maikaʻi loa nā pad pass-through i nā hoʻolālā kiʻekiʻe e hoʻemi i ka lōʻihi o ke ala a no laila ka inductance.E ʻoi aku ka maikaʻi o ka nānā ʻana inā loaʻa i kāu mea hana PCB nā lako hana e hana ai i kāu papa, no ka mea, ʻoi aku ka nui o ke kālā.Eia nō naʻe, inā ʻaʻole hiki iā ʻoe ke waiho i loko o ka gasket, e kau pololei a hoʻohana i nā mea ʻoi aku ma mua o hoʻokahi e hōʻemi i ka inductance.
Eia kekahi, hiki ke hoʻohana ʻia ka pass pad i ka hihia o ka lawa ʻole o ka wahi, e like me ka hoʻolālā micro-BGA, ʻaʻole hiki ke hoʻohana i ke ʻano fan-out kuʻuna.ʻAʻohe mea kānalua i ka liʻiliʻi o nā hemahema o ka puka ma ka welding disc, no ka noi ʻana i ka disc welding, nui ka hopena i ke kumukūʻai.ʻO ka paʻakikī o ke kaʻina hana a me ke kumukūʻai o nā kumu kumu ʻelua mau kumu nui e pili ana i ke kumukūʻai hana o ka hoʻopiha conductive.ʻO ka mea mua, ʻo Via i Pad kahi hana hou i ka hana hana PCB.Eia nō naʻe, i ka emi ʻana o ka helu o nā papa, pēlā nā kumukūʻai hou e pili ana me Via i ka ʻenehana Pad.
Pono o Via In Pad PCB
Via ma pad PCBs he nui pono.ʻO ka mea mua, hoʻomaʻamaʻa ia i ka hoʻonui nui ʻana, ka hoʻohana ʻana i nā pūʻolo spacing ʻoi aku ka maikaʻi, a me ka hoʻemi ʻana i ka inductance.He aha hou aʻe, ma ke kaʻina hana o ka via in pad, ua waiho pololei ʻia kahi via ma lalo o nā pad contact o ka hāmeʻa, hiki ke loaʻa i ka ʻāpana nui a me ke ala ʻoi aku ka maikaʻi.No laila hiki iā ia ke mālama i nā wahi PCB nui me ka pad no ka mea hoʻolālā PCB.
Ke hoʻohālikelike ʻia me nā vias makapō a me nā vias kanu ʻia, loaʻa i ka via in pad nā pōmaikaʻi penei:
He kūpono no ka mamao kikoʻī BGA;
Hoʻonui i ka nui o ka PCB, mālama i ka wahi;
E hoʻonui i ka wela;
Hāʻawi ʻia kahi pālahalaha a coplanar me nā mea ʻāpana;
No ka mea, ʻaʻohe ʻano o ka pā iwi ʻīlio, ua emi ka inductance;
E hoʻonui i ka mana voltage o ke awa kahawai;
Via In Pad Noi No SMD
1. E hoʻopili i ka puka me ka resin a e paʻi me ke keleawe
Kūpono me BGA VIA liʻiliʻi ma Pad;ʻO ka mea mua, pili ke kaʻina hana i ka hoʻopiha ʻana i nā puka me nā mea conductive a i ʻole nā mea hana ʻole, a laila e hoʻopili i nā lua ma luna o ka ʻili e hāʻawi i kahi maʻalahi no ka ʻili weldable.
Hoʻohana ʻia kahi puka puka i loko o kahi hoʻolālā pad e kau ai i nā ʻāpana ma ka puka pass a i ʻole e hoʻonui i nā hono solder i ka pilina puka pass.
2. Hoʻopiliʻia nā microhole a me nā puka ma ka pad
ʻO nā microholes nā puka IPC me ke anawaena o lalo o 0.15mm.Hiki iā ia ke puka ma waena (e pili ana i ka lakio hiʻohiʻona), akā naʻe, maʻamau, mālama ʻia ka microhole ma ke ʻano he puka makapō ma waena o nā papa ʻelua;ʻO ka hapa nui o nā microhole i wili ʻia me nā lasers, akā ke wili pū nei kekahi mau mea hana PCB me nā ʻāpana mechanical, ʻoi aku ka lohi akā ʻoki nani a maʻemaʻe;ʻO ke kaʻina hana Microvia Cooper Fill kahi kaʻina hana electrochemical deposition no nā kaʻina hana PCB multilayer, i ʻike ʻia ʻo Capped VIas;ʻOiai paʻakikī ke kaʻina hana, hiki ke hana ʻia i HDI PCBS e hoʻopiha ʻia ka hapa nui o nā mea hana PCB me ke keleawe microporous.
3. Hoʻopaʻa i ka lua me ka papa kuʻi kuʻi
He manuahi a kūpono me nā pad SMD solder nui;ʻAʻole hiki i ke kaʻina hana kuʻi kūʻē LPI maʻamau ke hana i kahi puka piha me ka ʻole o ka pilikia o ke keleawe ʻole i loko o ka pahu puka.ʻO ka maʻamau, hiki ke hoʻohana ʻia ma hope o ka paʻi ʻana o ka pale lua ma ka waiho ʻana o UV a i ʻole ka wela-cured epoxy solder resistances i loko o nā lua e hoʻopili iā lākou;Kāhea ʻia ma o ka paʻa ʻana.ʻO ka hoʻopili ʻana i loko o ka lua, ʻo ia ke ālai ʻana i nā lua me kahi mea pale e pale ai i ka leaka o ka ea i ka wā e hoʻāʻo ai i ka pā, a i ʻole e pale i nā kaapuni pōkole o nā mea kokoke i ka ʻili o ka pā.
