-
4 Layer ENIG FR4 Makapō i kanu ʻia ma o PCB
Nā ʻāpana: 4
Hoʻopau ʻili: ENIG
Mea kumu: FR4 Tg170
Layer waho W/S: 5.5/6mil
Papa loko W/S: 17.5mil
Mānoanoa: 1.0mm
Min.anawaena puka: 0.5mm
Kaʻina hana kūikawā: Blind Vias -
10 Layer ENIG FR4 Makapō Vias PCB
Nā ʻāpana: 10
Hoʻopau ʻili: ENIG
Mea kumu: FR4
W/S: 4/4mil
Mānoanoa: 1.6mm
Min.anawaena puka: 0.2mm
Kaʻina hana kūikawā: Blind Vias -
6 Layer HASL makapō i kanu ʻia ma o PCB
Papahana: 6
Hoʻopau i luna: HASL
Mea kumu: FR4
ʻO waho W/S: 9/4mil
Papa loko W/S: 11/7mil
Mānoanoa: 1.6mm
Min.anawaena puka: 0.3mm -
8 Layer ENIG Makapō i kanu ʻia ma o PCB
Nā ʻāpana: 8
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 3/3mil
Papa loko W/S: 3/3mil
Mānoanoa: 0.8mm
Min.anawaena puka: 0.1mm
Kaʻina hana kūikawā: Blind & Buried Vias -
14 Layer ENIG FR4 kanu ʻia ma o PCB
Nā ʻāpana: 14
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 4/5mil
Papa loko W/S: 4/3.5mil
Mānoanoa: 1.6mm
Min.anawaena puka: 0.2mm
Kaʻina hana kūikawā: Blind & Buried Vias -
4 Layer ENIG FR4 kanu ʻia ma o PCB
Nā ʻāpana: 4
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 6/4mil
Papa loko W/S: 6/5mil
Mānoanoa: 1.6mm
Min.anawaena puka: 0.3mm
Kaʻina hana kūikawā: Blind & Buried Vias, impedance control -
12 Layer ENIG FR4 Makapō Vias PCB
Nā ʻāpana: 12
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 7/4mil
Papa loko W/S: 5/4mil
Mānoanoa: 1.5mm
Min.anawaena puka: 0.25mm -
8 Layer ENIG FR4 kanu ʻia ma o PCB
Nā ʻāpana: 8
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 4.5/3.5mil
Papa loko W/S: 4.5/3.5mil
Mānoanoa: 1.6mm
Min.anawaena puka: 0.25mm
Kaʻina hana kūikawā: Blind & Buried Vias, impedance control -
6 Layer ENIG FR4 Makapō Vias PCB
Papahana: 6
Hoʻopau ʻili: ENIG
Mea kumu: FR4
W/S: 5/4mil
Mānoanoa: 1.0mm
Min.anawaena puka: 0.2mm
Kaʻina hana kūikawā: Blind Vias
