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16 Layer ENIG Press Fit Hole PCB
Nā ʻāpana: 16
Hoʻopau ʻili: ENIG
Mea kumu: FR4
Mānoanoa: 3.0mm
Min.anawaena puka:0.35mm
Nui:420×560mm
ʻO waho W/S: 4/3mil
Papa loko W/S: 5/4mil
Laki hiʻohiʻona: 9:1
Kaʻina hana kūikawā: via-in-pad, impedance control, press fit hole
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6 Layer ENIG FR4 Via-In-Pad PCB
Papahana: 6
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 4/3.5mil
Papa loko W/S: 4/3.5mil
Mānoanoa: 2.0mm
Min.anawaena puka:0.25mm
Kaʻina hana kūikawā: ma o-in-pad, ka mana impedance
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6 Layer ENIG FR4 Via-In-Pad PCB
Papahana: 6
Hoʻopau ʻili: ENIG
Mea kumu: FR4
W/S: 5/4mil
Mānoanoa: 1.0mm
Min.anawaena puka:0.2mm
Kaʻina hana kūikawā: via-in-pad
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6 Layer ENIG Via-In-Pad PCB
Papahana: 6
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 7/3.5mil
Papa loko W/S: 7/4mil
Mānoanoa: 0.8mm
Min.anawaena puka:0.2mm
Kaʻina hana kūikawā: via-in-pad
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8 Layer ENIG FR4 Via-In-Pad PCB
Nā ʻāpana: 8
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 4.5/3.5mil
Papa loko W/S: 4.5/3.5mil
Mānoanoa: 1.2mm
Min.anawaena puka:0.15mm
Kaʻina hana kūikawā: via-in-pad
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6 Layer FR4 ENIG Via In Pad PCB
Papahana: 6
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 4/3.5mil
Papa loko W/S: 4.5/3.5mil
Mānoanoa: 1.0mm
Min.anawaena puka:0.2mm
Kaʻina hana kūikawā: via in pad
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8 Layer ENIG FR4 Via-In-Pad PCB
Nā ʻāpana: 8
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 4/3.5mil
Papa loko W/S: 4/3.5mil
Mānoanoa: 1.0mm
Min.anawaena puka:0.2mm
Kaʻina hana kūikawā: ma o-in-pad, ka mana impedance
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10 Layer ENIG FR4 Via In Pad PCB
Papahana: 10
Hoʻopau ʻili: ENIG
Mea: FR4 Tg170
Laina waho W/S: 10/7.5mil
Laina loko W/S: 3.5/7mil
Papa mānoanoa: 2.0mm
Min.anawaena puka: 0.15mm
Puka hoʻopili: ma ka hoʻopiha piha ʻana
