computer-repair-london

Lako Hoolaha

Lako Pilikino PCB

I mea e hōʻemi ai i ka mamao o ka hoʻouna ʻana i ka hōʻailona a hōʻemi i ka nalowale o ka lawe ʻana i ka hōʻailona, ​​​​ka papa kamaʻilio 5G.

Kaʻanuʻu i ka uea kiʻekiʻe-density, ka uea spacing maikaʻi, tʻO ia ke kuhikuhi hoʻomohala o ka micro-aperture, ʻano lahilahi a me ka hilinaʻi kiʻekiʻe.

ʻO ka loiloi hohonu o ka ʻenehana hana a me ke kaʻina hana ʻana o nā poho a me nā kaapuni, ʻoi aku i nā pale ʻenehana.E lilo i mea hana maikaʻi loa o ka papa PCB kamaʻilio kūlana kiʻekiʻe 5G.

PCB电路板线路板生产加工制造厂家汇和电路通信设备

ʻOihana kamaʻilio a me nā huahana PCB

ʻoihana kamaʻilio Mea lako nui Pono nā huahana PCB PCB hiʻona
 

Uena uwea

 

kahua kahua kamaʻilio

Backplane, papa multilayer kiʻekiʻe-wikiwiki, kiʻekiʻe-frequency microwave papa, multi-hana metala substrate  

ʻO ke kumu metala, ka nui nui, ka multilayer kiʻekiʻe, nā mea alapine kiʻekiʻe a me ka voltage hui  

 

 

Uena hoʻouna

ʻO nā lako hoʻoili OTN, nā mea hoʻouna microwave backplane, ka papa multilayer kiʻekiʻe, ka papa microwave kiʻekiʻe Backplane, kiʻekiʻe-wikiwiki multilayer papa, kiʻekiʻe-frequency microwave papa  

Mea wikiwiki kiʻekiʻe, nui nui, multilayer kiʻekiʻe, kiʻekiʻe kiʻekiʻe, back drill, rigid-flex joint, high frequency material and mixed pressure

Kūkākūkā ʻikepili  

ʻO nā alahele, nā hoʻololi, lawelawe / mālama Devic

 

Backplane, papa multilayer kiʻekiʻe

Mea kiʻekiʻe-wikiwiki, nui nui, kiʻekiʻe multi-layer, kiʻekiʻe kiʻekiʻe, hoʻoheheʻe hope, ʻoʻoleʻa-flex hui
Paʻa paʻa pūnaewele broadband  

OLT, ONU a me nā lako fiber-to-the-home

Mea kiʻekiʻe-wikiwiki, nui nui, kiʻekiʻe multi-layer, kiʻekiʻe kiʻekiʻe, hoʻoheheʻe hope, ʻoʻoleʻa-flex hui  

Multilay

ʻO PCB o nā lako kamaʻilio a me ka terminal mobile

Lako Hoolaha

Hoʻokahi / pālua panel
%
4 papa
%
6 papa
%
8-16 papa
%
ma luna o 18 papa
%
HDI
%
PCD hikiwawe
%
Pākuʻi pūʻolo
%

Pahu Mobile

Hoʻokahi / pālua panel
%
4 papa
%
6 papa
%
8-16 papa
%
ma luna o 18 papa
%
HDI
%
PCD hikiwawe
%
Pākuʻi pūʻolo
%

Ke Kaʻina Hana Paʻakikī o ka High Frequency and High Speed ​​PCB Board

Lae paʻakikī Nā pilikia
Ka pololei hoʻolikelike ʻOi aku ka koʻikoʻi o ka pololei, a ʻo ka alignment interlayer e koi i ka convergence tolerance.ʻOi aku ka paʻakikī o kēia ʻano convergence ke hoʻololi ka nui o ka pā
STUB (Hoʻopau impedance) ʻOi aku ka koʻikoʻi o ka STUB, paʻakikī loa ka mānoanoa o ka pā, a pono ka ʻenehana wili hope.
 

Ka pololei o ka Impedance

He paʻakikī nui i ka etching: 1. ʻO nā mea etching: ʻo ka liʻiliʻi ʻoi aku ka maikaʻi, ke hoʻomalu ʻia ka hoʻomanawanui pololei etching e + /-1MIL no nā lineweights o 10mil a ma lalo, a me + /-10% no ka hoʻomanawanui linewidth ma luna o 10mil.2. ʻOi aku ka kiʻekiʻe o nā koi o ka laulā laina, ka laina laina a me ka mānoanoa laina.3. ʻO nā mea ʻē aʻe: ka nui o ka uwea, ka interlayer interlayer hōʻailona
Hoʻonui i ka noi no ka poho hōʻailona He paʻakikī nui ka mālama ʻana i ka ʻili o nā laminates keleawe a pau;koi ʻia nā tolerances kiʻekiʻe no ka mānoanoa PCB, me ka lōʻihi, ka laulā, ka mānoanoa, verticality, kakaka a me ka distortion, etc.
Ke ulu nei ka nui ʻOi aku ka maikaʻi o ka machinability, ʻoi aku ka maikaʻi o ka maneuverability, a pono e kanu ʻia ka lua makapō.Piʻi ke kumukūʻai2. ʻOi aku ka paʻakikī o ka pololei o ka alignment
Piʻi ka helu o nā papa ʻO nā hiʻohiʻona o nā laina denser a ma o, ʻoi aku ka nui o ka ʻāpana a me ka ʻāpana dielectric thinner, a me nā koi koʻikoʻi no ka lewa i loko, ka alignment interlayer, ka mana impedance a me ka hilinaʻi.

ʻO ka ʻike i hoʻonui ʻia i ka Papa Hoʻolaha Kūʻai ʻo HUIHE Circuits

ʻO nā koi no ke kiʻekiʻe kiʻekiʻe:

E emi ana ka hopena o crosstalk (noise) me ka emi ʻana o ka laina laina / spacing.

Nā koi impedance koʻikoʻi:

ʻO ka hoʻohālikelike impedance kikoʻī ka mea maʻamau o ka papa microwave kiʻekiʻe.ʻOi aku ka nui o ka impedance, ʻo ia hoʻi, ʻoi aku ka nui o ka hiki ke pale i ka hōʻailona mai ke komo ʻana i loko o ka papa dielectric, ʻoi aku ka wikiwiki o ka lawe ʻana i ka hōʻailona a me ka liʻiliʻi o ka poho.

Pono e kiʻekiʻe ka pololei o ka hana laina laina:

ʻO ka hoʻouna ʻana i ka hōʻailona kiʻekiʻe he koʻikoʻi loa ia no ka impedance ʻano o ka uea i paʻi ʻia, ʻo ia hoʻi, ʻo ka pololei o ka hana ʻana o ka laina hoʻouna maʻamau e koi pono i ka lihi o ka laina hoʻouna e maʻemaʻe loa, ʻaʻohe burr, notch, a i ʻole uea. hoopiha ana.

Nā pono mīkini:

ʻO ka mea mua, ʻokoʻa loa nā mea o ka papa microwave kiʻekiʻe me ka epoxy aniani lole lole o ka papa i paʻi ʻia;ʻO ka lua, ʻoi aku ka kiʻekiʻe o ka machining precision o ka papa microwave kiʻekiʻe ma mua o ka papa i paʻi ʻia, a ʻo ka hoʻomanawanui ʻano maʻamau ʻo ± 0.1mm (ma ke ʻano o ka precision kiʻekiʻe, ʻo ke ʻano hoʻomanawanui he ± 0.05mm).

Pumi huikau:

ʻO ka hoʻohana ʻana o ka substrate kiʻekiʻe-frequency (PTFE class) a me ka substrate kiʻekiʻe (PPE class) e hana i ka papa kaapuni kiʻekiʻe kiʻekiʻe kiʻekiʻe ʻaʻole wale he wahi conduction nui, akā loaʻa pū kekahi mau dielectric paʻa, nā koi pale dielectric kiʻekiʻe. a me ka pale wela kiʻekiʻe.I ka manawa like, pono e hoʻoholo ʻia ke ʻano maikaʻi ʻole o ka delamination a me ka hoʻoulu ʻana i ke kaomi ʻana ma muli o nā ʻokoʻa o ka adhesion a me ka hoʻonui ʻana i ka wela ma waena o nā papa ʻelua.

Pono ka hoʻohālikelike kiʻekiʻe o ka uhi:

ʻO ka impedance hiʻohiʻona o ka laina hoʻouna o ka papa microwave kiʻekiʻe e pili pono i ka maikaʻi o ka lawe ʻana i ka hōʻailona microwave.Aia kekahi pilina ma waena o ke ʻano impedance a me ka mānoanoa o ka pahu keleawe, ʻoi aku ka nui o ka pā microwave me nā lua metallized, ʻaʻole pili wale ka mānoanoa o ka uhi i ka nui o ka mānoanoa o ka pahu keleawe, akā pili pū i ka pololei o ka uea ma hope o ka etching. .no laila, pono e mālama pono ʻia ka nui a me ka like o ka mānoanoa o ka uhi.

ʻO ka hoʻoheheʻe ʻana i ka lua micro-ma o ka laser:

ʻO ka hiʻohiʻona nui o ka papa kiʻekiʻe kiʻekiʻe no ka kamaʻilio ʻana ʻo ia ka micro-through hole me ka puka makapō / kanu ʻia (aperture ≤ 0.15mm).I kēia manawa, ʻo ka hoʻoili ʻana i ka laser ke ala nui no ka hoʻokumu ʻana i nā lua micro-through.Hiki ke ʻokoʻa ka ratio o ke anawaena o ka puka a me ke anawaena o ka pā hoʻohui mai ka mea hoʻolako i ka mea hoʻolako.ʻO ka ratio anawaena o ka puka ma ka pā hoʻohui e pili ana i ka pololei o ka hoʻonohonoho ʻana o ka lua, a ʻoi aku ka nui o nā ʻāpana, ʻoi aku ka nui o ka deviation.i kēia manawa, hoʻohana pinepine ʻia e hahai i ka papa kuhikuhi wahi ma ka papa.No ka uwea kiʻekiʻe, aia nā disc pili ʻole ma nā puka.

ʻOi aku ka paʻakikī o ka mālama ʻana i ka ʻili:

Me ka hoʻonui pinepine ʻana, ʻoi aku ka nui o ke koho ʻana i ka mālama ʻana i ka ʻili, a ʻo ka uhi ʻana me ka conductivity uila maikaʻi a me ka uhi ʻili ʻoi loa ka liʻiliʻi o ka hopena i ka hōʻailona.Pono e like ka "roughness" o ka uea i ka mānoanoa o ka hoʻouna ʻana i hiki i ka hōʻailona hoʻouna ke ʻae, i ʻole e maʻalahi ka hana ʻana i ka hōʻailona koʻikoʻi "ka nalu kū" a me ka "noʻonoʻo" a pēlā aku.ʻO ka molecular inertia o nā substrates kūikawā e like me PTFE he mea paʻakikī ke hui pū me ka foil keleawe, no laila, pono ka hoʻomaʻamaʻa ʻili kūikawā e hoʻonui i ka ʻili o ka ʻili a i ʻole e hoʻohui i kahi kiʻi ʻoniʻoni ma waena o ka copper foil a me ka PTFE e hoʻomaikaʻi i ka adhesion.