computer-repair-london

Lako Hoolaha

Lako Pilikino PCB

I mea e pōkole ai ka mamao o ka hoʻouna ʻana i ka hōʻailona a hōʻemi i ka nalowale o ka lawe ʻana i ka hōʻailona, ​​​​ka papa kamaʻilio 5G.

Kaʻanuʻu i ka uea kiʻekiʻe-density, ka uea spacing maikaʻi, tʻO ia ke kuhikuhi hoʻomohala o ka micro-aperture, ʻano lahilahi a me ka hilinaʻi kiʻekiʻe.

ʻO ka loiloi hohonu o ka ʻenehana hana a me ke kaʻina hana o nā poho a me nā kaapuni, ʻoi aku i nā pale ʻenehana.E lilo i mea hana maikaʻi loa o ka papa PCB kamaʻilio kiʻekiʻe 5G.

PCB电路板线路板生产加工制造厂家汇和电路通信设备

ʻOihana kamaʻilio a me nā huahana PCB

ʻoihana kamaʻilio Mea lako nui Pono nā huahana PCB PCB hiʻona
 

Uena uwea

 

kahua kahua kamaʻilio

Backplane, papa multilayer kiʻekiʻe-nui, kiʻekiʻe-frequency microwave papa, multi-hana metala substrate  

ʻO ke kumu metala, ka nui nui, ka multilayer kiʻekiʻe, nā mea alapine kiʻekiʻe a me ka uila hui ʻia  

 

 

Uena hoʻouna

ʻO nā lako hoʻoili OTN, nā lako hoʻoili microwave backplane, ka papa multilayer kiʻekiʻe, ka papa microwave kiʻekiʻe ʻO ka mokulele hope, ka papa multilayer kiʻekiʻe, ka papa microwave kiʻekiʻe  

Mea wikiwiki kiʻekiʻe, nui nui, multilayer kiʻekiʻe, kiʻekiʻe kiʻekiʻe, back drill, rigid-flex joint, high frequency material and mixed pressure

Kūkākūkā ʻikepili  

Nā mea ala, nā hoʻololi, lawelawe / mālama ʻo Devic

 

Backplane, papa multilayer kiʻekiʻe

Mea kiʻekiʻe-wikiwiki, nui ka nui, kiʻekiʻe multi-layer, kiʻekiʻe kiʻekiʻe, hoʻoheheʻe hope, hui pū ʻia me ka paʻa
Paʻa pūnaewele broadband  

OLT, ONU a me nā lako fiber-to-the-home

Mea kiʻekiʻe-wikiwiki, nui ka nui, kiʻekiʻe multi-layer, kiʻekiʻe kiʻekiʻe, hoʻoheheʻe hope, hui pū ʻia me ka paʻa  

Multilay

ʻO PCB o nā lako kamaʻilio a me ka terminal mobile

Lako Hoolaha

Hoʻokahi / pālua panel
%
4 papa
%
6 papa
%
8-16 papa
%
ma luna o 18 papa
%
HDI
%
PCD hikiwawe
%
Pākuʻi pūʻolo
%

Pahu Mobile

Hoʻokahi / pālua panel
%
4 papa
%
6 papa
%
8-16 papa
%
ma luna o 18 papa
%
HDI
%
PCD hikiwawe
%
Pākuʻi pūʻolo
%

Ke Kaʻina Hana Paʻakikī o ka High Frequency and High Speed ​​PCB Board

Lae paʻakikī Nā pilikia
Pololei hoʻopololei ʻOi aku ka koʻikoʻi o ka pololei, a ʻo ka alignment interlayer e koi i ka convergence tolerance.ʻOi aku ka paʻakikī o kēia ʻano convergence ke loli ka nui o ka pā
STUB (Hoʻopau impedance) ʻOi aku ka koʻikoʻi o ka STUB, paʻakikī loa ka mānoanoa o ka pā, a pono ka ʻenehana wili hope.
 

Ka pololei o ka Impedance

He paʻakikī nui i ka etching: 1. ʻO nā mea etching: ʻo ka liʻiliʻi ʻoi aku ka maikaʻi, ke hoʻomalu ʻia ka hoʻomanawanui pololei etching e + /-1MIL no nā lineweights o 10mil a ma lalo, a me + /-10% no ka hoʻomanawanui linewidth ma luna o 10mil.2. ʻOi aku ka kiʻekiʻe o nā koi o ka laulā laina, laina laina a me ka mānoanoa laina.3. ʻO nā mea ʻē aʻe: ka nui o ka uwea, ka interlayer interlayer hōʻailona
Hoʻonui i ka noi no ka poho hōʻailona He paʻakikī nui ka mālama ʻana i ka ʻili o nā laminates keleawe a pau;koi ʻia nā tolerances kiʻekiʻe no ka mānoanoa PCB, me ka lōʻihi, ka laulā, ka mānoanoa, verticality, kakaka a me ka distortion, etc.
Ke ulu nei ka nui ʻOi aku ka maikaʻi o ka machinability, ʻoi aku ka maikaʻi o ka maneuverability, a pono e kanu ʻia ka lua makapō.Piʻi ke kumukūʻai2. ʻOi aku ka paʻakikī o ka pololei o ka alignment
E piʻi aʻe ka helu o nā papa ʻO nā hiʻohiʻona o nā laina denser a ma o, ʻoi aku ka nui o ka ʻāpana a me ka layer dielectric thinner, a me nā koi koʻikoʻi no ka lumi o loko, interlayer alignment, ka mana impedance a me ka hilinaʻi.

ʻO ka ʻike i hōʻiliʻili ʻia i ka papa hana kamaʻilio o nā kaapuni HUIHE

Nā koi no ka haʻahaʻa kiʻekiʻe:

E emi ana ka hopena o ka crosstalk (noise) me ka emi ʻana o ka laina laina / spacing.

Nā koi impedance koʻikoʻi:

ʻO ka hoʻohālikelike impedance kikoʻī ka mea pono loa o ka papa microwave kiʻekiʻe.ʻOi aku ka nui o ka impedance, ʻo ia hoʻi, ʻoi aku ka nui o ka hiki ke pale aku i ka hōʻailona mai ke komo ʻana i loko o ka papa dielectric, ʻoi aku ka wikiwiki o ka lawe ʻana i ka hōʻailona a me ka liʻiliʻi o ka poho.

Pono e kiʻekiʻe ka pololei o ka hana laina laina:

ʻO ka hoʻouna ʻana i ka hōʻailona alapine kiʻekiʻe he koʻikoʻi loa no ka impedance ʻano o ka uea i paʻi ʻia, ʻo ia hoʻi, ʻo ka pololei o ka hana ʻana o ka laina hoʻouna maʻamau e koi pono i ka lihi o ka laina hoʻouna e maʻemaʻe loa, ʻaʻohe burr, notch, a i ʻole uea. hoopiha ana.

Nā pono mīkini:

ʻO ka mea mua, ʻokoʻa loa nā mea o ka papa microwave kiʻekiʻe me ka epoxy aniani lole lole o ka papa i paʻi ʻia;ʻO ka lua, ʻoi aku ka kiʻekiʻe o ka machining precision o ka papa microwave kiʻekiʻe ma mua o ka papa i paʻi ʻia, a ʻo ka hoʻomanawanui ʻano maʻamau ʻo ± 0.1mm (i ka hihia o ka precision kiʻekiʻe, ʻo ke ʻano hoʻomanawanui he ± 0.05mm).

Pumi huikau:

ʻO ka hoʻohana ʻana o ka substrate kiʻekiʻe-frequency (PTFE class) a me ka substrate kiʻekiʻe (PPE class) e hana i ka papa kaapuni kiʻekiʻe kiʻekiʻe kiʻekiʻe ʻaʻole wale he wahi conduction nui, akā loaʻa pū kekahi mau dielectric paʻa, nā koi pale dielectric kiʻekiʻe. a me ka pale wela kiʻekiʻe.I ka manawa like, pono e hoʻoholo ʻia ke ʻano maikaʻi ʻole o ka delamination a me ka hoʻoneʻe ʻana i ke kaomi ʻana e nā ʻokoʻa o ka adhesion a me ka hoʻonui ʻana o ka wela ma waena o nā papa ʻelua.

Pono ka hoʻohālikelike kiʻekiʻe o ka uhi:

ʻO ka impedance hiʻohiʻona o ka laina hoʻouna o ka papa microwave kiʻekiʻe e pili pono i ka maikaʻi o ka lawe ʻana i ka hōʻailona microwave.Aia kekahi pilina ma waena o ka impedance hiʻohiʻona a me ka mānoanoa o ka pahu keleawe, ʻoi loa no ka microwave plate me nā lua metallized, ʻaʻole pili wale ka mānoanoa o ka uhi i ka nui o ka mānoanoa o ka pahu keleawe, akā pili pū i ka pololei o ka uea ma hope o ka etching. .no laila, pono e mālama pono ʻia ka nui a me ka like o ka mānoanoa o ka uhi.

ʻO ka hoʻoheheʻe ʻana i ka lua micro-ma o ka laser:

ʻO ka hiʻohiʻona nui o ka papa kiʻekiʻe kiʻekiʻe no ka kamaʻilio ʻana ʻo ia ka micro-through hole me ka puka makapō / kanu ʻia (aperture ≤ 0.15mm).I kēia manawa, ʻo ka hoʻoili ʻana i ka laser ke ala nui no ka hoʻokumu ʻana i nā lua micro-through.Hiki ke ʻokoʻa ka ratio o ke anawaena o ka puka a i ke anawaena o ka pā hoʻohui mai ka mea hoʻolako i ka mea hoʻolako.ʻO ka ratio anawaena o ka puka ma ka pā hoʻohui e pili ana i ka pololei o ka hoʻonohonoho ʻana o ka lua, a ʻoi aku ka nui o nā ʻāpana, ʻoi aku ka nui o ka deviation.i kēia manawa, hoʻohana pinepine ʻia e hahai i ka papa kuhikuhi wahi ma ka papa.No nā uwea kiʻekiʻe, aia nā disc pili ʻole ma nā lua.

ʻOi aku ka paʻakikī o ka mālama ʻana i ka ʻili:

Me ka hoʻonui pinepine ʻana, ʻoi aku ka nui o ka koho ʻana o ka mālama ʻana i ka ʻili, a ʻo ka uhi ʻana me ka conductivity uila maikaʻi a me ka uhi ʻili ʻoi loa ka liʻiliʻi o ka hopena i ka hōʻailona.Pono e like ka "roughness" o ka uea i ka mānoanoa o ka hoʻouna ʻana i hiki i ka hōʻailona hoʻouna ke ʻae, i ʻole e maʻalahi ka hana ʻana i ka hōʻailona koʻikoʻi "ka nalu kū" a me ka "noʻonoʻo" a pēlā aku.ʻO ka inertia molecular o nā substrate kūikawā e like me PTFE he mea paʻakikī ke hui pū me ka foil keleawe, no laila pono ka hoʻomaʻamaʻa ʻili kūikawā e hoʻonui i ka ʻili o ka ʻili a i ʻole e hoʻohui i kahi kiʻi ʻoniʻoni ma waena o ka copper foil a me ka PTFE e hoʻomaikaʻi i ka adhesion.