computer-repair-london

8 Layer ENIG FR4 Via-In-Pad PCB

8 Layer ENIG FR4 Via-In-Pad PCB

ʻO ka wehewehe pōkole:

Nā ʻāpana: 8

Hoʻopau ʻili: ENIG

Mea kumu: FR4

ʻO waho W/S: 4.5/3.5mil

Papa loko W/S: 4.5/3.5mil

Mānoanoa: 1.2mm

Min.anawaena puka:0.15mm

Kaʻina hana kūikawā: via-in-pad


Huahana Huahana

ʻO ka mea paʻakikī loa e hoʻomalu i ka lua plug i loko o ka via-in-pad, ʻo ia ka pōpō solder a i ʻole ka pā ma ka ʻīnika i loko o ka lua.Ma muli o ka pono o ka hoʻohana ʻana i ka BGA kiʻekiʻe kiʻekiʻe (ball grid array) a me ka miniaturization o SMD chip, ʻoi aku ka nui o ka hoʻohana ʻana i ka ʻenehana hole tray.Ma o ke kaʻina hana hoʻopiha hole, hiki ke hoʻohana ʻia ka ʻenehana hole i ka hoʻolālā a me ka hana ʻana i ka papa multilayer kiʻekiʻe, a pale i ka hoʻopili ʻana.Ua hoʻohana ʻo HUIHE Circuits i ka ʻenehana via-in-pad no nā makahiki he nui, a he hana kūpono a hilinaʻi hoʻi.

Nā ʻāpana o Via-In-Pad PCB

 

Nā huahana maʻamau

Nā huahana kūikawā

Nā huahana kūikawā

Kūlana hoʻopiha puka

IPC 4761 ʻAno VII

IPC 4761 ʻAno VII

-

Min Hole Anawaena

200µm

150µm

100µm

Ka nui o ka papa liʻiliʻi

400µm

350µm

300µm

Anawaena Hole Max

500µm

400µm

-

Nui pad kiʻekiʻe

700µm

600µm

-

Piʻi kiʻekiʻe loa

600µm

550µm

500µm

ʻAspect Ratio: Maʻamau ma o

1:12

1:12

1:10

ʻAspect Ratio: Makapō ma

1:1

1:1

1:1

Hana o ka Puka Puka

1. Kāohi i ke kī mai ka hele ʻana ma ka puka hoʻokele ma ka ʻili o ka ʻāpana i ka wā e kūʻai aku ai

2.Avoid koena flux i loko o ka-puka

3. Kāohi i nā kini pōpopo mai ka puka ʻana i waho i ka wā e kūʻai ana i ka nalu, e hopena i ke kaapuni pōkole

4. Kāohi i ka paʻi solder ili mai ka kahe ʻana i loko o ka lua, e hana ai i ka wiliwili virtual a pili i ka pono

Pono o Via-In-Pad PCB

1.Improve wela wela

2. Ua hoʻomaikaʻi ʻia ka volta hiki ke kū i ka vias

3. Hāʻawi i kahi pālahalaha a kūlike

4.Lower parasitic inductance

Ko makou Pono

1. Own factory, hale hana 12000 square meters, hale hana kuai pololei

2. Hāʻawi ka hui kūʻai aku i ka wikiwiki a me ke kūlana kiʻekiʻe ma mua o ke kūʻai aku a ma hope o ke kūʻai aku

3.Process-e pili ana i ka ʻikepili hoʻolālā PCB e hōʻoia i hiki i nā mea kūʻai ke nānā a hōʻoia i ka manawa mua


  • Mua:
  • Aʻe:

  • E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou