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8 Layer ENIG FR4 Multilayer PCB

8 Layer ENIG FR4 Multilayer PCB

ʻO ka wehewehe pōkole:

Nā ʻāpana: 8
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 4/4mil
Papa loko W/S: 3.5/3.5mil
Mānoanoa: 1.6mm
Min.anawaena puka: 0.45mm


Huahana Huahana

Ka Paʻakikī o ka Multilayer PCB Board Prototyping

1. ʻO ka paʻakikī o ka alignment interlayer

Ma muli o ka nui o nā papa o ka papa PCB multilayer, ʻoi aku ka kiʻekiʻe o ka calibration o ka papa PCB.ʻO ka maʻamau, mālama ʻia ka alignment tolerance ma waena o nā papa ma 75um.ʻOi aku ka paʻakikī o ka mālama ʻana i ka alignment o ka papa PCB multilayer ma muli o ka nui o ka ʻāpana, ke kiʻekiʻe o ka mahana a me ka haʻahaʻa i ka papa hana hoʻololi kiʻi, ka dislocation overlap ma muli o ka like ʻole o nā papa kumu like ʻole, a me ke ʻano kūlana ma waena o nā papa. .

 

2. Ka pilikia o ka hana kaapuni i loko

Hoʻohana ka papa PCB multilayer i nā mea kūikawā e like me ka TG kiʻekiʻe, ke kiʻekiʻe kiʻekiʻe, ke alapine kiʻekiʻe, ke keleawe kaumaha, ka ʻāpana dielectric lahilahi a me nā mea ʻē aʻe, e kau ana i nā koi kiʻekiʻe no ka hana kaapuni i loko a me ka mana kiʻi nui.No ka laʻana, hoʻonui ka paʻakikī o ka hoʻouna ʻana i ka hōʻailona impedance i ka paʻakikī o ka hana kaapuni i loko.He liʻiliʻi ka laulā a me ka laina laina, hoʻonui ke kaʻapuni hāmama a me ke kaapuni pōkole, haʻahaʻa ka helu hele;me nā ʻāpana hōʻailona laina lahilahi, e piʻi aʻe ka ʻike leakage o loko AOI.ʻO ka pā o loko he lahilahi, maʻalahi ke wrinkle, maikaʻi ʻole ka ʻike ʻana, maʻalahi ke curl etching;ʻO ka PCB multilayer ka hapa nui o ka papa ʻōnaehana, ʻoi aku ka nui o ka ʻāpana a me ke kumukūʻai kiʻekiʻe.

 

3. Paʻakikī i ka lamination a me ka hana kūpono

Nui nā papa i loko a me nā papa semi-cured i hoʻopaʻa ʻia, kahi e hiki ai i nā hemahema e like me ka slide plate, lamination, resin void a me ke koena o ka bubble i ka hana stamping.I ka hoʻolālā ʻana o ka hale laminated, pono e noʻonoʻo pono ʻia ke kūpaʻa wela, ka pale ʻana i ke kaomi, ka maʻamau o ke kolu a me ka mānoanoa dielectric o ka mea, a pono e hana ʻia kahi papa hana paʻi kūpono o ka pā multilayer.Ma muli o ka nui o nā papa, ʻaʻole kūlike ka hoʻonui ʻana a me ka hoʻokaʻawale ʻana a me ka nui o ka coefficient uku, a maʻalahi ka maʻalahi o ka ʻāpana insulating inter-layer e alakaʻi i ka hiki ʻole o ka hoʻāʻo hilinaʻi ma waena.

 

4. Nā pilikia hana wili

ʻO ka hoʻohana ʻana i ka TG kiʻekiʻe, ke kiʻekiʻe kiʻekiʻe, ke alapine kiʻekiʻe, ka pā keleawe keleawe mānoanoa e hoʻonui ai i ka paʻakikī o ka wili ʻana, ka wili burr a me ka paʻakikī o ka wehe ʻana i nā ʻili.Nui nā papa, nā mea hana wili e maʻalahi ke wāwahi;ʻO ka hemahema o CAF ma muli o ka BGA paʻa a me ka hoʻokaʻawale ʻana o ka pā haiki he mea maʻalahi ke alakaʻi i ka pilikia wili ʻana ma muli o ka mānoanoa PCB.


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