4 Layer ENIG PCB 8329
Iecaianoaaiiuo enehana o metallized hapalua puka PCB
ʻO ka lua hapalua metallized ʻoki ʻia i ka hapalua ma hope o ka hoʻokumu ʻia o ka lua āpau. Maʻalahi ke ʻike ʻia ke ʻano o ke koena uea keleawe a me ka pale keleawe keleawe i ka lua o ka lua, kahi e hoʻopili ai i ka hana o ka lua hapa a alakaʻi i ka hōʻemi o ka hana a me ka hua. I mea e lanakila ai i nā kīnā o luna, e hoʻokō ʻia ia e like me nā kaʻina hana aʻe o ka PCB semi-orifice metallized.
1. ʻO ka hana ʻana i ka hapalua puka pahi V ʻano pahi.
2. I ka lua o ka drill, hoʻohui ʻia ka puka alakaʻi ma ka lihi o ka lua, lawe ʻia ka ʻili keleawe ma mua, a hoʻemi ʻia ka burr. Hoʻohana ʻia nā ʻūlū no ka ʻeli ʻana e hoʻonui i ka wikiwiki o ka hāʻule.
3. ʻO ke keleawe keleawe ma ka substrate, no laila kahi papa keleawe e uhi ana ma ka paia o ka puka pōʻai ma ka lihi o ka pā.
4. Hana ʻia ke kaapuni waho e ka kiʻi ʻopihia, ka hōʻike a me ka hoʻomohala ʻana o ka mea i lalo, a laila hoʻopaʻa ʻia ka substrate me ke keleawe a me ka piuta i ʻelua mau manawa, no laila ke keleawe keleawe ma ka paia puka o ka lua āpau ma ka lihi o ka mānoanoa ka papa a uhi ʻia ka papa keleawe e ka uhi tin me ka hopena anti-corrosion;
5. ʻO ka hapalua puka e hana ana i ka lihi a puni ka puka i ʻoki ʻia i ka hapalua e hana i kahi puka hapa;
6. ʻO ka wehe ʻana i ke kiʻi ʻoniʻoni e hoʻoneʻe i ke kiʻi anti-plating i paʻi ʻia i ke kaʻina hana o ke kiʻi ʻoniʻoni.
7. E hoʻopaʻa i ka mea hoʻohaʻahaʻa, a hemo i ka uhi keleawe e hōʻike ʻia i ka papa waho o ka mea ma hope o ka hemo ʻana o ke kiʻi ʻoniʻoni.
ʻO ka peeling Tin kahi e ʻihi ʻia ka mea i lawe ʻia ka tin mai ka paia semi-perforated a hōʻike ʻia ka papa keleawe ma ka paia semi-perforated.
8. Ma hope o ka hoʻoheheʻe ʻana, e hoʻohana i ka lipine ʻulaʻula e pili pū i nā pā unit, a ma luna o ka laina etching alkaline e hemo ai nā burrs
9. Ma hope o ka plating keleawe lua a me ka plating tin ma ka substrate, ʻokiʻoki ʻia ka lua pōʻai ma ka lihi o ka pā i ʻāpana a lilo i hapalua. Ma muli o ka uhi ʻia ʻana o ka pā keleawe o ka paia o ka lua me ka papa piʻina, a pili pono ke keleawe keleawe o ka paia o ka lua me ka papa keleawe o ka papa waho o ka mea substrate, a nui ka mana paʻa, ka pā keleawe ma ka lua. hiki ke hōʻalo maikaʻi ʻia ka paia i ka wā e ʻoki ai, e like me ka huki ʻana a i ʻole ke ʻano o ke kaua keleawe;
10. Ma hope o ka pau ʻana o ka hapalua puka e hana ana a laila e hemo i ke kiʻi ʻoniʻoni, a laila etch, ʻaʻole e hiki ke hoʻoheheʻe ʻia o ke keleawe, pale pono i ke koena o ke keleawe a me nā hanana pōkole pōkole, hoʻomaikaʻi i ka hua o ka PCB semi-hole metallized.