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4 Layer ENIG FR4 Half Hole PCB

4 Layer ENIG FR4 Half Hole PCB

ʻO ka wehewehe pōkole:

Nā ʻāpana: 4
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 8/4mil
Papa loko W/S: 8/4mil
Mānoanoa: 0.6mm
Min.anawaena puka: 0.2mm
Kaʻina hana kūikawā: hapalua puka


Huahana Huahana

ʻO ka Half Hole PCB Splicing Method

Ma ka hoʻohana ʻana i ke ʻano o ka hoʻopili ʻana i ka puka stamp, ʻo ke kumu ka hana ʻana i ka pā hoʻohui ma waena o ka pā liʻiliʻi a me ka pā liʻiliʻi.I mea e maʻalahi ai ka ʻoki ʻana, e wehe ʻia kekahi mau puka ma ka piko o ka pā (ʻo ke anawaena o ka lua maʻamau ʻo 0.65-0.85 MM), ʻo ia ka puka peʻa.I kēia manawa, pono ka papa i ka mīkini SMD, no laila ke hana ʻoe i ka PCB, hiki iā ʻoe ke hoʻohui i ka papa i nā PCB he nui.i ka manawa Ma hope o ka SMD, pono e hoʻokaʻawale ʻia ka papa hope, a hiki i ka lua hōʻailona ke hoʻokaʻawale i ka papa.ʻAʻole hiki ke ʻoki ʻia ka ʻaoʻao hapalua puka V, hana ʻole ʻia ka gong (CNC).

1.V-ʻoki splicing pā, hapalua puka PCB lihi mai hana V-oki hana (e huki keleawe uea, ka hopena i ole keleawe puka)

2. Hoʻopaʻa Pepa

ʻO ke ʻano o ka hoʻopili ʻana i ka PCB ʻo ia ka V-CUT, ka pilina alahaka, ka lua pili alahaka i kēia mau ala, ʻaʻole hiki ke nui ka nui o ka splice, ʻaʻole hiki ke liʻiliʻi loa, ʻo ka papa liʻiliʻi liʻiliʻi hiki ke hoʻopili i ka hoʻoheheʻe ʻana i ka pā a i ʻole ka wili kūpono. akā e hoʻopili i ka PCB.

I mea e hoʻomalu ai i ka hana ʻana i ka pā metala hapa-hole, lawe ʻia kekahi mau ana no ka hele ʻana i ka paia o ka lua i ka ʻili keleawe ma waena o ka metala hapalua a me ka puka nonmetallic ma muli o nā pilikia ʻenehana.ʻO ka PCB hapa-hole metalized he PCB i nā ʻoihana like ʻole.He maʻalahi ka hapalua o ka lua metala e huki ai i ke keleawe i loko o ka lua i ka wā e wili ai i ka ʻaoʻao, no laila ua kiʻekiʻe loa ke kiʻekiʻe.No ka hoʻohuli ʻana i loko, pono e hoʻololi ʻia ka huahana pale i ke kaʻina hope ma muli o ka maikaʻi.Hoʻohana ʻia ke kaʻina hana o kēia ʻano pā e like me nā kaʻina hana: wili (drilling, gong groove, plate plating, external light imaging, graphic electroplating, drying, half hole treatment, film removal, etching, tin removal, other process, kino).

Hōʻike Lako

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ʻO ka laina hoʻoheheʻe ʻakomi PCB

PCB kaapuni papa PTH laina hana

PCB PTH Line

15-PCB kaapuni kaapuni LDI 'akomi laser scan laina mīkini

PCB LDI

12-PCB kaapuni kaapuni CCD mīkini hoʻolaha

Mīkini Hoʻolaha PCB CCD

Hōʻike Hale Hana

Hōʻike ʻoihana

Papa Hana Hana PCB

woleisbu

Luna Hookipa

hana (2)

Keena Halawai

hana (1)

Keena Nui


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