ʻOi aku ka maikaʻi o 12 Layer ENIG FR4 Blind Vias PCB Manufacturer and Factory |Kaapuni Huihe

12 Layer ENIG FR4 Makapō Vias PCB

ʻO ka wehewehe pōkole:

Nā ʻāpana: 12
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 7/4mil
Papa loko W/S: 5/4mil
Mānoanoa: 1.5mm
Min.anawaena puka: 0.25mm

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

HDI PCB Material

ʻO nā mea HDI PCB he RCC, LDPE, FR4

RCC:He pōkole ka Resin coated Copper no ka resin coated copper foil.RCC ua haku 'ia me ka keleawe foil a me ka resin me ka oolea ili, ka wela a me ka anti-oxidation lapaau (hoʻohana 'ia ka mānoanoa o ka oi ma mua o 4mil).Eia kekahi, pono e hoʻokō i nā koi kūpono o ka laminate, e like me:

(1) Ka hilinaʻi insulation kiʻekiʻe a me ka micro ma o ka hilinaʻi;

(2) Kiʻekiʻe aniani hoʻololi wela (TG);

(3) Haʻahaʻa dielectric mau a me ka wai absorption;

(4) He kiʻekiʻe adhesion a me ka ikaika i ke keleawe foil;

(5) Ma hope o ka ho'ōla ʻana, ua like ka mānoanoa o ka papa insulation

I ka manawa like, no ka mea, he ʻano huahana hou ʻo RCC me ka ʻole o ke aniani aniani, hiki ke hoʻohana ʻia i ka laser a me ka plasma etching treatment, a kūpono hoʻi i ka pā māmā a me ka lahilahi.Eia kekahi, he 12pm ka pahu keleawe i uhi ʻia i ka resin, 18pm ʻeleʻele keleawe lahilahi, maʻalahi ke hana.