ʻOi aku ka maikaʻi o 4 Layer ENIG SF302 + FR4 Rigid-Flex PCB Manufacturer a Factory |Kaapuni Huihe

4 Layer ENIG SF302+FR4 Rigid-Flex PCB

ʻO ka wehewehe pōkole:

Papahana: 4
Hoʻoponopono Kūikawā: Papa Rigid-Flex
Ili Pau: ENIG
Mea Hana: SF302+FR4
Track W/S: 5/5mil
Track Loko W/S: 6/6mil
Mānoanoa Papa: 1.0mm
Min.Anawaena puka: 0.3mm

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Nā Manaʻo no ka Noʻonoʻo ʻana i ka Hoʻolālā ʻana o ka ʻāpana hui ʻoluʻolu paʻa

1. Pono e hoʻololi maʻalahi ka laina, a ʻo ke kuhikuhi o ka laina e kū pololei i ke kuhikuhi ʻana.

2. E hoʻokaʻawale ʻia ka conductor ma ka ʻāpana kūlou.

3. E hoʻonui ʻia ka laulā o ka conductor a puni ka ʻāpana kūlou.

4. ʻAʻole pono e hoʻohana ʻia ka hoʻolālā PTH ma kahi ʻāpana hoʻololi paʻakikī.

5. Bending radius o ka piko o ka ʻāpana o ka PCB hikiwawe paʻa

Mea o ka PCB hikiwawe

Ua kamaʻāina nā kānaka a pau i nā mea Rigid, a hoʻohana pinepine ʻia nā ʻano mea FR4.Eia nō naʻe, pono e noʻonoʻo ʻia nā koi he nui no nā mea PCB paʻa paʻa.Pono e kūpono no ka adhesion, maikaʻi wela kū'ē, i mea e hōʻoia i ka paakiki flexural hoʻopaʻa 'āpana o ka ia degere o ka hoʻonui ma hope o ka wela me ka deformation.Hoʻohana nā mea hana maʻamau i ke ʻano resin o nā mea PCB paʻa.

No nā mea maʻalahi, koho i kahi substrate a uhi i ke kiʻiʻoniʻoni me ka liʻiliʻi liʻiliʻi o ka hoʻonui a me ka ʻokiʻoki.Hoʻohana maʻamau i nā mea hana PI paʻakikī, akā hoʻohana pololei hoʻi i ka substrate non-adhesive no ka hana ʻana.ʻO nā mea flex penei:

Mea Kumu: FCCL (Ka Laminate Copper Clad Laminate)

PI.Polymide: Kapton (12.5 um / 20 um / 25 um / 50 um / 75um).ʻO ka loli maikaʻi, ke kūpaʻa wela kiʻekiʻe (ʻo ka mahana hoʻohana lōʻihi he 260 ° C, pōkole 400 ° C), ka hoʻoheheʻe kiʻekiʻe kiʻekiʻe, nā hiʻohiʻona uila a me nā mechanical maikaʻi, maikaʻi ke kūpaʻa waimaka.Kūleʻa maikaʻi i ke aniau, kūpaʻa kemika a me ka pale ahi.ʻO ka polyester imide (PI) ka mea i hoʻohana nui ʻia.PET.Polyester (25 um / 50 um / 75um).Maikaʻi, ʻoluʻolu maikaʻi a kūʻē i ka waimaka.ʻO nā waiwai mechanical a me nā uila maikaʻi e like me ka ikaika tensile, ke kūpaʻa wai maikaʻi a me ka hygroscopicity.Akā ma hope o ka hoʻomehana ʻia ʻana, ʻoi aku ka nui o ka shrinkage rate a ʻilihune ka pale wela kiʻekiʻe.ʻAʻole kūpono no ka hoʻoheheʻe ʻana i ka wela kiʻekiʻe, ka helu heheʻe 250°C, liʻiliʻi i hoʻohana ʻia

Membrane Uhi

ʻO ka hana nui o ka uhi kiʻiʻoniʻoni e pale i ke kaapuni, pale i ke kaapuni mai ka makū, ka pollution a me ka welding.The Conductive Layer hiki ke Rolled Annealed Copper, Electrodeposited Copper and Silver Ink.ʻO ke ʻano aniani o ke keleawe electrolytic he ʻeleʻele, ʻaʻole kūpono i ka hua laina maikaʻi.He maʻemaʻe ke ʻano o ke aniani keleawe calendered, akā maikaʻi ʻole ka hoʻopili ʻana me ke kiʻi kumu.Hiki ke hoʻokaʻawale ʻia mai ke ʻano o ke kiko a me ka ʻōwili keleawe foil.He keleawe ʻulaʻula ka pepa keleawe electrolytic, keʻokeʻo keʻokeʻo keʻokeʻo calendering copper foil.ʻO nā mea hana hou a me nā mea hoʻopaʻapaʻa: kaomi ʻia ma kahi ʻāpana o ka PCB flex no ka hoʻohui ʻana i nā ʻāpana a i ʻole ka hoʻohui ʻana i nā mea paʻakikī no ke kau ʻana.Loaʻa i ka kiʻi hoʻoikaika FR4, ka pā resin, ka hoʻopili paʻa paʻa, ka hoʻoikaika ʻana i ka pepa alumini, etc.

Non-Kahe/Low Flow glue semi-cured pepa (Low Flow PP).Hoʻohana ʻia nā pilina ʻo Rigid a Flex no Rigid flex PCB, maʻamau ʻo PP lahilahi loa.

Mua: 8 Layer HASL FPC+FR4 Rigid-Flex PCB

Aʻe: 4 Layer FPC+FR4 Rigid Flex PCB

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