No ke aha e hoʻoheheʻe ʻia ai ka PCB keleawe plating maʻamau?

No ke aha e hoʻoheheʻe ʻia ai ka PCB keleawe plating maʻamau?

PCB maʻamauʻO ka hoʻoheheʻe ʻana o ka ʻili kekahi o nā hemahema maikaʻi maʻamau i ke kaʻina hana o PCB.Ma muli o ka paʻakikī o ke kaʻina hana PCB a me ka mālama ʻana i ke kaʻina hana, ʻoi aku ka paʻakikī o ka mālama ʻana i ka wai kemika, paʻakikī ke pale ʻana i nā hemahema o ka papa.

ʻO ka ʻōhū ma luna o kaPapa PCBʻO ia ka pilikia o ka ikaika hoʻopaʻa maikaʻi ʻole ma ka papa, a ma ka hoʻonui ʻana, ʻo ka pilikia o ka maikaʻi o ka ʻili ma ka papa, aia nā ʻano ʻelua:

1. PCB ili maʻemaʻe pilikia;

2. Micro roughness (a i ole ikehu ili) o ka ili PCB;Hiki ke hōʻuluʻulu ʻia nā pilikia hū a pau ma ka papa kaapuni e like me nā kumu i luna.ʻO ka ikaika paʻa ma waena o ka uhiʻana heʻilihune a haʻahaʻa paha, i ka hana ma hope a me ke kaʻina hana a me ke kaʻina hana hui he mea paʻakikī ke kū'ē i ka hana a me ke kaʻina hana i hanaʻia i loko o ke koʻikoʻi pale, mechanical stress a me ka wela, a pēlā aku, e hopena i nā mea likeʻole. degere o ka hoʻokaʻawale ʻana ma waena o ke ʻano o ka uhi ʻana.

Ua hōʻuluʻulu ʻia kekahi mau mea e hoʻohaʻahaʻa i ka maikaʻi o ka ʻili i ka PCB hana a me ka hana ʻana penei:

ʻO ka substrate PCB maʻamau - nā pilikia lapaʻau i ke kaʻina hana paʻa keleawe;ʻOi loa no kekahi mau mea ʻoi aku ka lahilahi (ma lalo o 0.8 mm), no ka mea, ʻoi aku ka ʻilihune o ka substrate, ʻaʻole maikaʻi ka hoʻohana ʻana i ka mīkini palaki pulupulu, ʻaʻole hiki iā ia ke wehe pono i ka substrate i mea e pale ai i ka oxidation o ka ʻili keleawe i ke kaʻina hana. a me ka hana a me ka papa hana kūikawā, ʻoiai ʻoi aku ka lahilahi o ka ʻāpana, maʻalahi ka wehe ʻana i ka pā palaka, akā paʻakikī ka hana kemika, No laila, he mea nui e hoʻolohe i ka mana i ka hana ʻana a me ka hana ʻana, i ʻole e hoʻopilikia i ka pilikia. o ka huʻa ʻana i kumu ʻia e ka ikaika hoʻopaʻa maikaʻi ʻole ma waena o ka substrate copper foil a me ke keleawe kemika;i ka wā e ʻeleʻele ai ka ʻeleʻele ʻeleʻele o loko, e ʻeleʻele hoʻi ka ʻeleʻele a me ka browning, ka waihoʻoluʻu ʻole, a me ka ʻeleʻele kūloko.

ʻO ka ʻili o ka papa PCB i ke kaʻina hana o ka mīkini (wili, lamination, milling, etc.) i hana ʻia e ka aila a i ʻole nā ​​​​mea ʻino ʻē aʻe o ka lepo lepo ka mālama ʻana.

3. He ilihune ka PCB copper sinking brush plate: the pressure of the grinding plate before copper sinking is too large, resulting in hole deformation, and the copper foil fillet at the hole and even the base material leakage at the hole, which will cause bubbles. hanana i loko o ka lua i ke kaʻina o ke keleawe poho, plating, tin spraying a me ka wiliwili;ʻOiai inā ʻaʻole i hoʻoheheʻe ʻia ka substrate i ka pā palahū, e hoʻonui ka nui o ka palapala pala i ka ʻawaʻawa o ka lua keleawe, no laila i ke kaʻina o ka micro-corrosion coarsening, ua maʻalahi ka copper foil e hana i ke ʻano coarsening nui, aia. e loaʻa pū kekahi pilikia maikaʻi;No laila, pono e uku ʻia i ka hoʻoikaika ʻana i ke kaʻina o ke kaʻina o ka pā palapala, a hiki ke hoʻoponopono ʻia nā ʻāpana kaʻina o ka palapala pala i ka maikaʻi ma o ka hōʻailona hōʻailona a me ka hōʻike kiʻiʻoniʻoni wai.

4. Holoi PCB pilikia: no ka mea kaumaha keleawe electroplating kaʻina hana pono e hala i ka hailona o kemika wai lāʻau lapaʻau hana, a pau 'ano o ka waikawa-kumu ka non-polar organic solvent e like me ka laau, papa holoi maka 'aʻole maʻemaʻe, oi aku koʻikoʻi ke keleawe hoʻololi i hoʻohui i. ʻO nā mea hana, ʻaʻole hiki ke hoʻomake wale i ka cross-contamination, e hoʻokau pū i ka papa i ka hoʻoponopono kūloko a i ʻole ka hopena maikaʻi ʻole o ka mālama ʻana, ka hemahema o ka ʻole, e hoʻokau i kekahi o ka ikaika paʻa;no laila, pono e noʻonoʻo i ka hoʻoikaika ʻana i ka mana o ka holoi ʻana, ʻoi aku ka nui o ka mālama ʻana i ke kahe o ka wai hoʻomaʻemaʻe, ka maikaʻi o ka wai, ka manawa holoi, a me ka manawa kulu o nā ʻāpana pā;ʻoi aku ka nui o ka hoʻoilo, haʻahaʻa ka mahana, e hoʻemi nui ʻia ka hopena o ka holoi ʻana, pono e uku ʻia i ka mana o ka holoi ʻana.