ʻO ka mea nui no ka hana PCB

ʻO nā mea nui no ka hana PCB

I kēia mau lā, nui nā mea hana PCB, ʻaʻole kiʻekiʻe a haʻahaʻa paha ke kumukūʻai, maikaʻi a me nā pilikia ʻē aʻe a mākou i ʻike ʻole ai, pehea e koho ai.hana PCBmea?ʻO nā mea hana, ka mea maʻamau i ʻaʻahu ʻia i ke keleawe, ke kiʻiʻoniʻoni maloʻo, ka inika, a me nā mea ʻē aʻe.

1. Aahu keleawe

Kāhea ʻia ka pā keleawe ʻaoʻao ʻelua.Hiki ke uhi paʻa ʻia ka pahu keleawe ma ka substrate e ka mea hoʻopaʻa, a ʻo ka ikaika o ka wehe ʻana o ka pā lole keleawe e hilinaʻi nui ʻia i ka hana o ka mea hoʻopili.ʻO ka mānoanoa o 1.0 mm, 1.5 mm a me 2.0 mm ʻekolu ka mānoanoa o ka pā keleawe aahu.

(1) nā ʻano o nā papa keleawe.

Nui nā ʻano hana hoʻokaʻawale no nā papa keleawe.ʻO ka mea maʻamau e like me ka mea hoʻoikaika paʻa pā he ʻokoʻa, hiki ke hoʻokaʻawale ʻia i: kumu pepa, kumu aniani fiber lole kumu, kumu kumu (CEM series), multi-layer plate base a me nā kumu waiwai kūikawā (ceramic, metal core base, etc.) ʻelima. waeʻano.E like me nā ʻokoʻa resin adhesives i hoʻohana ʻia e ka papa, ʻo ka pepa maʻamau CCL i hoʻokumu ʻia he: phenolic resin (XPC, XXXPC, FR-L, FR-2, etc.), epoxy resin (FE-3), polyester resin a me nā ʻano ʻē aʻe. .He epoxy resin ka CCL (FR-4, FR-5) i kēia manawa, ʻo ia ka mea i hoʻohana nui ʻia o ke kumu aniani.ʻO nā resin kūikawā ʻē aʻe (me ka lole fiber glass, nylon, non-woven, etc. e hoʻonui i ka mea): ʻelua maleic imide i hoʻololi ʻia i ka triazine resin (BT), polyimide (PI) resin, diphenylene ideal resin (PPO), maleic acid obligation imine - styrene resin (MS), poly (oxygen acid ester resin, polyene embedded in resin, etc. E like me ka flame retardant properties o CCL, hiki ke mahele ia i ka lapalapa ahi a me ka non-flame retardant papa. me ka nānā nui aku i ka mālama ʻana i ke kaiapuni, ua hoʻomohala ʻia kahi ʻano CCL hou me ka ʻole o nā mea wao nahele i ka CCL pale ahi, hiki ke kapa ʻia ʻo "CCL flame retardant". , mai ka hoʻohālikelike hana o CCL, hiki ke hoʻokaʻawale ʻia i ka CCL hana maʻamau, CCL mau dielectric haʻahaʻa, CCL pale wela kiʻekiʻe, coefficient hoʻonui thermal haʻahaʻa CCL (hoʻohana mau ʻia no ka substrate packaging) a me nā ʻano ʻē aʻe.

(2)nā hōʻailona hana o ka pā lole keleawe.

Ke aniani hoʻololi wela.Ke piʻi ka mahana i kekahi māhele, e hoʻololi ka substrate mai ka "moku'āina aniani" a i ka "moku'āina Ruber", kapa ʻia kēia mahana ʻo ke aniani transition temperature (TG) o ka pā.ʻO ia hoʻi, ʻo TG ka wela kiʻekiʻe loa (%) kahi e paʻa ai ka substrate.ʻO ia hoʻi, nā mea substrate maʻamau i ka wela kiʻekiʻe, ʻaʻole wale ka hana palupalu, deformation, hoʻoheheʻe a me nā mea ʻē aʻe, akā hōʻike pū kekahi i ka emi ʻana o nā ʻano mechanical a me nā uila.

ʻO ka maʻamau, ʻoi aku ka TG o nā papa PCB ma luna o 130 ℃, ʻo ka TG o nā papa kiʻekiʻe ma luna o 170 ℃, a ʻo ka TG o nā papa waena ma luna o 150 ℃.ʻO ka maʻamau he waiwai TG o 170 paʻi paʻi, i kapa ʻia he papa paʻi TG kiʻekiʻe.Hoʻomaikaʻi ʻia ka TG o ka substrate, a e hoʻomaikaʻi ʻia a hoʻomaikaʻi ʻia ka pale ʻana o ka wela, ka pale ʻana i ka wai, ka pale kemika, ke kūpaʻa a me nā ʻano ʻē aʻe o ka papa i paʻi ʻia.ʻOi aku ka kiʻekiʻe o ka waiwai TG, ʻoi aku ka maikaʻi o ka pale wela o ka pā, ʻoi aku ka maikaʻi ma ke kaʻina alakaʻi ʻole.kiʻekiʻe TG PCBhoʻohana nui ʻia.

2. Dielectric mau.

Me ka hoʻomohala wikiwiki o ka ʻenehana uila, hoʻomaikaʻi ʻia ka wikiwiki o ka hoʻoili ʻana i ka ʻike.I mea e hoʻonui ai i ke kahawai kamaʻilio, ua hoʻololi ʻia ka hoʻohana pinepine ʻana i ke kahua alapine kiʻekiʻe, e koi ana i ka mea substrate e loaʻa i kahi haʻahaʻa dielectric mau E a haʻahaʻa dielectric nalowale TG.Ma ka hōʻemi wale ʻana i ka E hiki ke loaʻa ka wikiwiki o ka hoʻouna ʻana i nā hōʻailona kiʻekiʻe, a ma ka hōʻemi wale ʻana i ka TG hiki ke hōʻemi ʻia ka nalowale o ka hoʻouna ʻana.

3. Koefficient hoonui wela.

Me ka hoʻomohala ʻana o ka pololei a me ka multilayer o ka papa paʻi a me ka BGA, CSP a me nā ʻenehana ʻē aʻe, ua kau nā hale hana PCB i nā koi kiʻekiʻe no ka paʻa ʻana o ka nui o ka pā keleawe.ʻOiai e pili ana ka paʻa ʻana o ka pā keleawe keleawe i ke kaʻina hana, e hilinaʻi nui ʻia i nā mea waiwai ʻekolu o ka pā keleawe keleawe: resin, mea hoʻoikaika a me ka foil keleawe.ʻO ke ala maʻamau e hoʻololi i ka resin, e like me ka epoxy resin i hoʻololi ʻia;E ho'ēmi i ka lakene o ka resin, akā, e ho'ēmi ana kēia i ka hoʻokuʻu uila a me nā waiwai kemika o ka substrate;He liʻiliʻi ka mana o ka pahu keleawe i ka paʻa o ka pā keleawe. 

4.Hana pale UV.

I ke kaʻina hana o ka papa kaapuni, me ka popularization o photosensitive solder, i mea e pale aku ai i ka malu lua i hoʻokumu 'ia e ka like like 'ana ma na aoao elua, a pau substrates i ka hana o ka pale UV.Nui nā ala e BLOCK ai i ka hoʻouna ʻana i ke kukui ULTRAVIOLET.ʻO ka mea maʻamau, hiki ke hoʻololi ʻia hoʻokahi a ʻelua ʻano lole fiber aniani a me ka resin epoxy, e like me ka hoʻohana ʻana i ka resin epoxy me ka UV-block a me ka hana ʻike maka.

ʻO Huihe Circuits kahi hale hana PCB ʻoihana, ua hoʻāʻo ikaika ʻia kēlā me kēia kaʻina.Mai ka papa kaapuni e hana i ke kaʻina hana mua a hiki i ka nānā ʻana i ka maikaʻi o ke kaʻina hope, pono e nānā pono ʻia ka papa ma luna o ka papa.ʻO ke koho ʻana i nā papa, ka ʻīnika i hoʻohana ʻia, nā mea hana i hoʻohana ʻia, a me ke koʻikoʻi o nā limahana hiki ke hoʻopili i ka maikaʻi hope o ka papa.Mai ka hoʻomaka ʻana a hiki i ka nānā ʻana i ka maikaʻi, loaʻa iā mākou ka mākaʻikaʻi ʻoihana e hōʻoia i ka pau ʻana o kēlā me kēia kaʻina hana maʻamau.E hui pū me mākou!