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8 Layer ENIG Hoʻomalu ʻOihana Rigid Flex PCB
Nā ʻāpana: 8
ʻOihana Hoʻohana: Ka Mana Hana
Hoʻopau ʻili: ENIG
W/S: 6/6mil
Mānoanoa: 1.6mm
Min.anawaena puka:0.2mm
laminate:1R+2R+2F+2R+1R -
10 Layer High Density ENIG Multilayer PCB
Nā ʻāpana: 10
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 4.5/2.5mil
Papa loko W/S: 4/3.5mil
Mānoanoa: 1.0mm
Min.anawaena puka: 0.3mm -
4 Layer ENIG FR4 Kaumaha PCB
Nā ʻāpana: 4
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 12/5mil
Papa loko W/S: 12/5mil
Mānoanoa: 1.6mm
Min.anawaena puka: 0.25mm
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4 Layer ENIG FR4 + RO4350 Hui Pū ʻIa Lamination PCB kiʻekiʻe
Nā ʻāpana: 4
Mea Hana:FR4+Rogers 4350B
Min.anawaena puka: 0.3mm
Laina Laina: 0.230mm
Kekahi Laina: 0.170mm
Lapaʻau ʻili: ENIG
Mānoanoa: 1.0mm -
4 Layer ENIG FPC+FR4 Rigid-Flex PCB
Papahana: 4
ʻOihana Hoʻohana: Ka Mana Hana
W/S: 6/6mil
Mānoanoa Papa: 0.4mm
MIn.Anawaena puka: 0.2mm
Ili Pau: ENIG
Mea: FR4 + FPC
laminate: 1F+2R+1R -
8 Layer FPC+FR4 Rigid Flex PCB
Nā ʻāpana: 8
ʻOihana Hoʻohana: Ka Mana Hana
Hoʻopau ʻili: ENIG
Mea kumu: FR4 + FPC
W/S: 5/5mil
Mānoanoa: 1.6mm
Min.anawaena puka:0.2mm
laminate: 2R+2F+2F+2R -
4 Layer FPC+FR4 Rigid Flex PCB
Papahana: 4
Ka Hana Kūikawā: Rigid-Flex
Mea: FR4+FPC
Track W/S: 4/3.5mil
Track Loko W/S: 5/4mil
Mānoanoa Papa: 0.5mm
Min.Anawaena puka: 0.2mm -
8 Layer ENIG Impedance Control Heavy Copper PCB
Nā ʻāpana: 8
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 7/4mil
Papa loko W/S: 5/4.5mil
Mānoanoa: 1.0mm
Min.anawaena puka: 0.2mm
Kaʻina hana kūikawā: Impedance Control+Heavy Copper -
10 Layer ENIG FR4 Makapō Vias PCB
Nā ʻāpana: 10
Hoʻopau ʻili: ENIG
Mea kumu: FR4
W/S: 4/4mil
Mānoanoa: 1.6mm
Min.anawaena puka: 0.2mm
Kaʻina hana kūikawā: Blind Vias -
6 Layer HASL makapō i kanu ʻia ma o PCB
Papahana: 6
Hoʻopau i luna: HASL
Mea kumu: FR4
ʻO waho W/S: 9/4mil
Papa loko W/S: 11/7mil
Mānoanoa: 1.6mm
Min.anawaena puka: 0.3mm -
8 Layer ENIG Makapō i kanu ʻia ma o PCB
Nā ʻāpana: 8
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 3/3mil
Papa loko W/S: 3/3mil
Mānoanoa: 0.8mm
Min.anawaena puka: 0.1mm
Kaʻina hana kūikawā: Blind & Buried Vias -
6 Layer ENIG Impedance Half Hole PCB
Papahana: 6
Hoʻopau ʻili: ENIG
Mea kumu: FR4
ʻO waho W/S: 4/4mil
Papa loko W/S: 4/4mil
Mānoanoa: 1.2mm
Min.anawaena puka: 0.2mm
Kaʻina hana kūikawā: Impedance, hapalua puka
