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4 Layer ENIG RO4003+AD255 Lamination PCB

4 Layer ENIG RO4003+AD255 Lamination PCB

ʻO ka wehewehe pōkole:

Nā ʻāpana: 4
Hoʻopau ʻili: ENIG
Mea kumu: Arlon AD255+Rogers RO4003C
Min.anawaena puka: 0.5mm
W/S liʻiliʻi loa:7/6mil
Mānoanoa: 1.8mm
Kaʻina hana kūikawā: Puka makapō


Huahana Huahana

RO4003C Rogers kiʻekiʻe pinepine PCB Materials

Hiki ke hoʻoneʻe ʻia ka mea RO4003C me kahi kāhili nylon maʻamau.ʻAʻole koi ʻia kahi lawelawe kūikawā ma mua o ka electroplating keleawe me ka ʻole o ka uila.Pono e mālama ʻia ka pā me ke kaʻina hana epoxy/aniani maʻamau.Ma keʻano laulā, ʻaʻole pono e wehe i ka lua no ka mea ʻaʻole maʻalahi ka wehe ʻana o ka ʻōnaehana resin TG kiʻekiʻe (280°C+[536°F]) i ka wā o ke kaʻina wili.Inā hoʻokumu ʻia ka ʻili ma kahi hana wīwī ikaika, hiki ke hoʻoneʻe ʻia ka resin me ka hoʻohana ʻana i ka pōʻaiapili plasma CF4/O2 maʻamau a i ʻole ma ke kaʻina hana ʻelua alkaline permanganate.

Hiki ke hoʻomākaukau ʻia ka ʻili o ka RO4003C no ka pale māmā.Manaʻo ʻia e hoʻohana i nā photoresists maʻamau aqueous a semi-aqueous.Hiki ke hoʻohana ʻia nā wiper keleawe i kūʻai ʻia.ʻO nā masks hiki ke kānana a i ʻole ke kiʻi i hoʻohana mau ʻia no nā laminates epoxy/aniani pili pono i ka ʻili o ro4003C.ʻO ka hoʻomaʻemaʻe mīkini o nā ʻili dielectric i hōʻike ʻia ma mua o ka hoʻohana ʻana i nā masks welding a me nā ʻili i koho ʻia "kakau inoa" e pale i ka pili pono.

ʻO nā koi kuke o nā mea ro4000 e like me nā epoxy / aniani.ʻO ka mea maʻamau, ʻaʻole pono nā mea hana i kuke ʻole i nā pā epoxy/aniani e kuke i nā pā ro4003.No ka hoʻokomo ʻana i ke aniani epoxy/baked ma ke ʻano o ka hana maʻamau, paipai mākou i ka kuke ʻana ma 300°F, 250°f (121°c-149°C) no 1 a 2 mau hola.ʻAʻole i loaʻa i ka Ro4003C ka pale ahi.Hiki ke hoʻomaopopo ʻia ʻo kahi pā i hoʻopaʻa ʻia i loko o kahi ʻāpana infrared (IR) a i ʻole ka hana ʻana ma kahi haʻahaʻa haʻahaʻa haʻahaʻa hiki ke piʻi i nā mahana ma mua o 700°f (371°C);Hiki iā Ro4003C ke hoʻomaka i ka puhi ʻana i kēia mau wela kiʻekiʻe.ʻO nā ʻōnaehana e hoʻohana mau ana i nā ʻenehana reflux infrared a i ʻole nā ​​​​mea hana ʻē aʻe e hiki ke hōʻea i kēia mau wela kiʻekiʻe e pono e mālama i nā mea e pono ai e hōʻoiaʻiʻo ʻaʻohe pilikia.

Hiki ke mālama mau ʻia nā laminates kiʻekiʻe ma ka lumi wela (55-85 ° F, 13-30 ° C), haʻahaʻa.Ma ka lumi wela, ʻaʻole inert nā mea dielectric i ka haʻahaʻa kiʻekiʻe.Eia nō naʻe, hiki ke hoʻoheheʻe ʻia nā uhi metala e like me ke keleawe ke ʻike ʻia i ka haʻahaʻa kiʻekiʻe.Hiki i ka hoʻomaʻemaʻe mua ʻana o PCBS ke wehe maʻalahi i ka corrosion mai nā mea mālama pono.

Hiki ke hana ʻia ka mea RO4003C me ka hoʻohana ʻana i nā mea hana maʻamau no ka epoxy / aniani a me nā kūlana metala paʻakikī.Pono e hoʻoneʻe ʻia ka pahu keleawe mai ke ala alakaʻi e pale ai i ka hamo.

ʻO Rogers RO4350B/RO4003C Nā Kūlana Mea

Waiwai RO4003C RO4350B Kuhikuhi Unite Kūlana ʻAno hoʻāʻo
Dk(ε) 3.38±0.05 3.48±0.05   - 10GHz/23 ℃ IPC.TM.6502.5.5.5Ho'āʻo laina microstrip clamp
Dk(ε) 3.55 3.66 Z - 8 a 40GHz ʻano lōʻihi o ka pae ʻokoʻa

Ka helu poho(tan δ)

0.00270.0021 0.00370.0031   - 10GHz/23 ℃2.5GHz/23 ℃ IPC.TM.6502.5.5.5
 Kaumaha wela odielectric mau  +40 +50 Z ppm/℃ 50 ℃ i 150 ℃ IPC.TM.6502.5.5.5
Kū'ē Volume 1.7X100 1.2X1010   MΩ.cm COND A IPC.TM.6502.5.17.1
Kūʻē ʻili 4.2X100 5.7X109   0.51mm(0.0200) IPC.TM.6502.5.17.1
Hoomanawanui Uila 31.2(780) 31.2(780) Z KV/mm(V/mil) ʻO RT IPC.TM.6502.5.6.2
Tensile Modulus 19650(2850)19450(2821)  16767(2432)14153(2053) XY MPa(kpsi) ʻO RT ASTM D638
Ikaika U'i 139(20.2)100(14.5)  203(29.5)130(18.9) XY  MPa(kpsi)   ASTM D638
Kulou ikaika 276(40)  255(37)    MPa(kpsi)   IPC.TM.6502.4.4
Paʻa Paʻa <0.3 <0.5 X,Y mm/m(mils/inihi) Ma hope o ka etching+E2/150 ℃ IPC.TM.6502.4.39A
CTE 111446 101232 XYZ ppm/℃ 55 a 288 ℃ IPC.TM.6502.4.41
ʻO Tg >280 >280   ℃ DSC A IPC.TM.6502.4.24
Td 425 390   ℃ TGA   ASTM D3850
ʻO ka hoʻoili wela 0.71 0.69   W/m/K 80 ℃ ASTM C518
Ka Hoʻomoe ʻana i ka Māmā 0.06 0.06   % 0.060" hoʻokomo ʻia i loko o ka wai ma 50°C no 48 mau hola ASTM D570
ʻO ka mānoanoa 1.79 1.86   gm/cm3 23 ℃ ASTM D792
Ikaika Peel 1.05(6.0) 0.88(5.0)   N/mm(pli) 1 oz.EDC ma hope o ka bleaching tin IPC.TM.6502.4.8
Hoʻopaʻa ahi N/A V0       UL94
Lf lapaʻau kūpono ʻAe ʻAe        

Noi o RO4003C High Frequency PCB

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Nā huahana kamaʻilio kelepona

图片4

Power Splitter, coupler, duplexer, kānana a me nā mea hana ʻē aʻe

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Ka Mana Mana, Haʻahaʻa Noise Amplifier, etc

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Pūnaehana anti-collision kaʻa, ʻōnaehana ukali, ʻōnaehana radio a me nā kahua ʻē aʻe

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