2 Layer OSP F4B High Frequency PCB
E pili ana i ka F4B High Frequency PCB
Hoʻokumu ʻia ʻo Wangling F4B i nā koi hana uila o nā kaʻa microwave,
He ʻano papa kaapuni paʻi microwave maikaʻi loa me nā waiwai uila maikaʻi a me ka ikaika mechanical kiʻekiʻe.
Design Of F4B High Frequency PCB
I ka hoʻolālā o ka PCB kiʻekiʻe-frequency, mea hoʻolālā maʻamau e uku nui i ka dielectric mau (DK) a me ka tangent nalowale (DF) o ka PCB i ke koho ʻana i nā mea, a e hoʻolohe wale i ka mānoanoa o ke keleawe keleawe ke koho ʻana i ke keleawe keleawe. maʻalahi ka haʻalele ʻana i ka mana o nā ʻano ʻano like ʻole o ka palaka keleawe keleawe ma nā waiwai uila o nā huahana.
Hōʻike ka nānā ʻana o SEM i ka micro morphology o nā ʻano like ʻole o ka ʻili keleawe a me ka ʻili hoʻopili dielectric he ʻokoʻa loa ke ʻano o nā ʻano like ʻole.I ka hoʻolālā ʻana o ka laina microstrip, ʻo ke ʻano o ka copper foil a me ka dielectric contact surface e pili pono i ka nalowale o ka hoʻokomo ʻana o ka laina hoʻouna holoʻokoʻa.
Nā Kūlana Mea O F4B PCB
Hana ʻia ʻo Wangling F4B i nā mea kiʻekiʻe kiʻekiʻe e like me nā koi hana uila o nā kaʻa microwave.Loaʻa iā ia ka hana uila maikaʻi a me ka ikaika mechanical kiʻekiʻe.He papa haʻahaʻa haʻahaʻa paʻi microwave maikaʻi loa ia.ʻO ka maʻamau 15N/cm ka wela mau a me ka 260 ℃ ± 2 ℃ fusion welding mea e mālama ai i 20 kekona me ka ʻole o ka huʻa, ʻaʻohe stratification a me ka ikaika peeling ≥12 N/cm.
ʻAno mea | Hoʻohālike | Mea Hoopiha | Dk(@10GHZ) | Df(@10GHZ) |
F4B-1/2 | PTFE+Paʻa aniani | 2.55/2.65 | ≤0.001 | |
F4BK | F4BK225 | PTFE+Paʻa aniani | 2.55 | ≤0.001 |
F4BK265 | PTFE+Paʻa aniani | 2.65 | ≤0.001 | |
F4BK300 | PTFE+Paʻa aniani | 3 | ≤0.001 | |
F4BK350 | PTFE+Paʻa aniani | 3.5 | ≤0.001 | |
F4BM | F4BM220 | PTFE+Paʻa aniani | 2.2 | ≤0.007 |
F4BM225 | PTFE+Paʻa aniani | 2.55 | ≤0.007 | |
F4BM265 | PTFE+Paʻa aniani | 2.65 | ≤0.007 | |
F4BM300 | PTFE+Paʻa aniani | 3 | ≤0.007 | |
F4BM350 | PTFE+Paʻa aniani | 3.5 | ≤0.007 |