10 Layer ENIG Impedance Control PCB
E pili ana i ka Multilayer PCB
ʻO ka PCB Multilayer e pili ana i ka PCB multilayer i hoʻohana ʻia i nā huahana uila, ka papa multilayer me ka hoʻohana ʻana i ka papa wili hoʻokahi a ʻelua paha.Me ka papa ʻelua, ʻelua ala hoʻokahi no ka ʻaoʻao waho a i ʻole ʻelua ʻāpana papalua, ʻelua poloka o ka papa o waho o ka papa kaapuni i pai ʻia, ma o ka hoʻonohonoho ʻana a me nā mea hoʻopili insulation a me nā kiʻi conductive interconnection e like me ke koi ʻana o ka papa kaapuni paʻi. ʻehā, ʻeono papa PCB, ʻike ʻia ʻo multilayer PCB.
He ʻokoʻa o nā kaʻina hana PCB
ʻO ka hoʻomalu impedance PCB
E kaohi pono i ka laula/mānoanoa conductor a me ka mānoanoa waena
Impedance linewidth tolerance ≤± 5%, maikaʻi impedance pili
Hoʻohana ʻia i nā hāmeʻa kiʻekiʻe a me ka wikiwiki a me nā lako kamaʻilio 5g
ʻO ka PCB paʻa-Flex
Maʻalahi a lahilahi, e hoʻomaʻamaʻa i ke kaʻina hana hui huahana
Hoʻemi i nā mea hoʻohui, hiki ke lawe laina kiʻekiʻe
Hoʻohana ʻia i ka ʻōnaehana kiʻi a me nā lako kamaʻilio RF
Via-i-Pad PCB
E hoʻohana i ka electroplating no ka hoʻopiha ʻana i nā lua/puan plug resin
Hōʻalo i ka paʻi solder a i ʻole nā kahe e kahe ana i loko o nā lua pā
Kāohi i nā puka me nā pahu pahu a i ʻole ke alakaʻi ʻīnika i ka weld
Module Bluetooth no ka ʻoihana uila uila
PCB keleawe kaumaha
Hiki i ke keleawe ke piʻi i ka 12 OZ a he kiʻekiʻe ke au
ʻO FR-4/Teflon/ceramic ka mea
Hoʻohana ʻia i ka lako mana kiʻekiʻe, kaapuni kaʻa
Hōʻike Lako
ʻO ka laina hoʻoheheʻe ʻakomi PCB
PCB PTH Laina
PCB LDI
Mīkini Hoʻolaha PCB CCD
Hōʻike Hale Hana
Papa Hana Hana PCB
Luna Hookipa
Keena Halawai
